Electronics manufacturing

Outsourcing of Your Electronics Manufacturing

A growing market and increasingly complex technologies are leading to greater challenges in the electronics industry. As a result, the demand for manufacturing services with shorter lead times and more intricate assembly tasks is rising.

Baudisch Electronic is well-equipped to meet these demands. With modern assembly and soldering systems, we manufacture assemblies and devices for various industries at the highest level. Our highly flexible electronics manufacturing is carried out using both SMD (Surface-Mounted Device) and THT (Through-Hole Technology) processes. To ensure top quality even for complex assembly tasks, we rely on comprehensive quality management (certified to DIN EN ISO 9001), specially trained technicians, and the use of the latest technologies.

At every stage of the project, we provide consulting to our customers and ensure a smooth manufacturing process, as well as flexible and reliable execution.

PCB Assembly

Precise SMD assembly is carried out at high speed using six Fuji NXT III placement machines. With integrated 3D solder paste inspection and full traceability of all components, we ensure optimal assembly quality.

In our THT production facilities, assemblies are manufactured flexibly and with high quality using wave and selective soldering processes.

To keep our machinery up to date with the latest technology, we regularly expand and upgrade our equipment.

We produce large volumes quickly and cost-effectively. Thanks to short setup times, the economical production of small and medium-sized batches is also easily achievable.

More about SMD Assembly

More about THT Assembly

Electronics manufacturing using the SMD process.
Electronics manufacturing using the THT process: Wave soldering system
Quality control in SMD manufacturing with 3D SPI

Quality Control in Electronics Manufacturing

Quality controls are carried out during the electronics manufacturing process. Each solder paste application is recorded using an integrated 3D SPI system and evaluated based on characteristics such as height, position, volume, and shape. If the result does not meet the requirements, the PCB is immediately rejected. In the case of a systematic error, it can be quickly identified and corrected.

Additionally, optical inspections such as AOI (Automated Optical Inspection) and specialized microscopy for BGAs ensure flawless assembly quality. Electrical testing includes final functional tests of the assemblies.

Quality Management

Device Assembly

We manufacture and assemble our customers’ electronic devices. Complex assembly tasks are carried out quickly and precisely thanks to our specially trained specialists and modern assembly stations.

Upon request, we also perform electrical function tests, programming, and commissioning of electronic devices.

For high production volumes, we design customized lean workstations tailored to the specific product. Special assembly stations are also available for small batches, ensuring cost-effective assembly for both small and large series.

Device Assembly

Material Procurement

In the current challenging supply market, reliable communication, a well-connected procurement team, and forward-thinking, effective planning are of utmost importance.

As an EMS service provider, we take care of sourcing all the necessary components for electronics production and device assembly upon request. To ensure the availability of components, we leverage our global network of suppliers. Critical components are stocked in advance when needed.

Lifecycle Management

REQUEST A QUOTE NOW

Send us your inquiry and receive a non-binding offer for our EMS services. If you don’t have exact details yet, simply providing your contact information is sufficient. We will get back to you promptly to create a customized quote for your project.

Contact us

    IHRE KONTAKTDATEN:





    ELEKTRONIKENTWICKLUNG:

    HardwareentwicklungSoftwareentwicklung

    Beschreibung

    PRODUKT | BAUGRUPPE:




    FERTIGUNG VON:

    einer Baugruppeeinem Komplettgerät

    MATERIALBESCHAFFUNG | MATERIALBEISTELLUNG:

    durch Baudisch100 % Beistellungsiehe StücklisteLeiterplatte wird beigestellt (Wenn nicht, bitte Gerberfile im Anhang senden)

    ANGABEN ZUR LEITERPLATTE:



    Abmessungen der Einzelplatine (in mm):
    Länge Breite Höhe


    BESTÜCKUNGSTECHNOLOGIE:

    SMD-Bestückung
    einseitigzweiseitig

    THT-Bestückung
    einseitigzweiseitig

    PRÜFUNG:
    Optische Prüfung mit "Quins"AOIElektrische Prüfung

    GEHÄUSE:

    BeistellungBeschaffung durch Baudisch

    Gehäuseabmessungen (in mm)
    Länge Breite Höhe

    Gehäusematerial
    ALV2AV4AKunststoffPulverbeschichtet
    Andere Materialien:

    RAL-Farbe:

    BEMERKUNGEN:

    DATENBEREITSTELLUNG:

    StücklisteGerberdaten der LeiterplatteKoordinatenlisteBestückungsplanZeichnungenSchablonendatenFotosWeitere Anlagen

    Ich habe Interesse an einer EMV-Prüfung bei Baudisch Electronic. Bitte lassen Sie mir nähere Informationen zukommen.

    Bitte beweise, dass du kein Spambot bist und wähle das Symbol Schlüssel.

    *Pflichtfeld