PIN IN PASTE: THR TECHNOLOGY IN ELECTRONICS PRODUCTION
Pin-in-paste technology, also known as THR (through-hole reflow) technology, has taken a significant place in electronics production. This method offers numerous advantages, particularly when processing leaded (THT) components in the reflow process.
HOW DOES THE PIN-IN-PASTE TECHNOLOGY WORK?
With pin-in-paste technology, wired components are processed in a reflow process. This process involves applying solder paste to the vias for the pins, followed by insertion of the component by an automatic placement machine. As the solder paste melts in the reflow oven, the liquid solder is drawn back into the through-hole plating by wetting and capillary forces and forms the solder joint.
1. filling the holes: The vias on the PCB are filled with solder paste using a squeegee.
2. inserting the pins: The pins of the THT components are inserted into the holes filled with paste by the placement machine.
3. soldering in the reflow oven: The solder paste melts in the reflow oven, pulls up on the pin and fills the through-hole plating.
REQUIREMENTS FOR THR COMPONENTS
Heat-resistant plastic
The plastic of the components must be suitable for higher temperatures in order to withstand the reflow soldering process.
Moisture content
THR components must have the correct moisture content, which must be taken into account during the reflow process to prevent damage.
Housing distance
The housing of the components should have pins that ensure the correct distance to the solder paste. This enables a visual inspection and sufficient air flow under the housing.
Longer contacts
THR components require longer contacts than conventional THT components to ensure a reliable connection through the PCB.
THE POSITIVE ASPECTS OF PIN-IN-PASTE TECHNOLOGY
- Time saving: Total production time is reduced as separate soldering processes are no longer required.
- Process optimization: By integrating THR components into the SMD process, subsequent steps can be saved.
- Automatic placement: THR components can be placed directly with SMD placement machines.
- Environmental friendliness: By reducing material and energy consumption and shortening production time, this contributes to reducing the ecological footprint in electronics production.
POTENTIAL RISKS THAT NEED TO BE CONSIDERED
- Limited application: Not all types of components are suitable. Certain sizes, shapes or material properties cannot be soldered using this method.
- Limited design flexibility: Due to the specific requirements of the pin-in-paste process, design aspects such as the placement of components on the PCB may be limited.
- PCB thickness: The PCB must have a certain thickness so that THR components can be used.
- Costs: THR components are usually more expensive than conventional THT components. This could increase the total cost of production and should be taken into account when planning the budget.
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